Kuala lumpur: Universiti Sains Malaysia (USM): has launched an Advanced Semiconductor Research Laboratory based on the Intel 18A Process Design Kit (PDK) and formalised a USM-Purdue University semiconductor partnership.
According to BERNAMA News Agency, USM stated that the events strengthen Malaysia’s position as a new leader in semiconductor research, integrated circuit design, and high-value talent development under the Higher Education Ministry’s Artificial Intelligence (AI) in Semiconductor and Industry-on-Campus initiative. Through this collaboration, USM, via the Collaborative Microelectronic Design Excellence Centre (CEDEC), becomes the first university outside the United States (US) to access the Intel 18A PDK, one of the world’s most advanced complementary metal-oxide-semiconductor (CMOS) technologies.
This technology enables the development of high-density, low-power integrated circuits optimised for AI applications, allowing USM to train chip design engineers using technology on par with global industry standards. Recognising USM’s growing leadership in advanced-node design education and research, the Intel Foundry also named USM as a “focus university for design enablement workforce development.”
The lab is equipped with high-end electronic design automation (EDA) infrastructure, high-performance servers, and integrated circuit design flows tailored for the 18A technology. Developed together with Intel’s design team, the facility serves as a national hub for advanced-node integrated circuit design (18A), research on AI-based chip architectures, multidisciplinary projects including 2.5D/3D integration and advanced packaging, as well as the development of semiconductor expertise for both local and global industries.
The lab supports USM’s role in advancing the National Semiconductor Strategy, particularly in high-value design activities. The statement also mentioned that USM and Purdue University, a world-leading engineering institution, signed a memorandum of understanding to expand collaboration in teaching, professional certification, research, and talent development.
According to USM, Purdue’s expertise in advanced packaging, 3D integration, and design automation will strengthen USM’s capability in supporting the national semiconductor ecosystem. USM Vice-Chancellor Prof Datuk Seri Dr Abdul Rahman Mohamed expressed that the partnership is a step toward making Malaysia a global hub for high-value semiconductor innovation, demonstrating the country’s ability to progress into advanced-node integrated circuit design and world-class semiconductor research.
Higher Education Director-General Datuk Professor Dr Azlinda Azman officiated at the launch of the laboratory.