Barbing:ERS electronic has unveiled a fully automated panel-level packaging (PLP) system designed for 310×310 mm substrates, integrating carrier bonding, debonding, and detaping into one platform. This innovation aims to streamline production processes by combining traditionally separate steps into a single automated system. According to BERNAMA News Agency, the new system is capable of processing 13 panels per hour, eliminating the need for inter-tool transfers across thermally critical steps. The first unit has been delivered to a major semiconductor manufacturer for integration into its production line. Developed at ERS electronic's Advanced Packaging facility in Germany, the system reflects over five decades of thermal management expertise and more than 30 years of machine-building capabilities. This development follows the 2024 integration of a semiconductor equipment engineering team into ERS. ERS has been a pioneer in panel-level packaging, having delivered its first commercial tool to Fraunhofer IZ M in 2018. The 310×310 mm format is becoming more popular due to its efficient substrate area utilization compared to traditional 300 mm wafers. The panel-level packaging market is expected to grow substantially, with Yole Group projecting a compound annual growth rate exceeding 40% over the next five years. Dual-carrier bonding and debonding processes are increasingly crucial for advanced packaging applications such as 3D IC, high-bandwidth memory, and 2.5D IC packaging. ERS's new platform integrates all process steps into one system, reducing handling time and risk without altering the existing fab layout, thereby addressing significant challenges in semiconductor manufacturing.