Kuala lumpur: ZEISS, a technology enterprise operating in the fields of optics and optoelectronics, has introduced ZEISS VersaXRM 5 Insight, a hybrid 3D X-ray microscope designed to help researchers and engineers analyse samples faster.
According to BERNAMA News Agency, the new system combines X-ray microscopy and microCT in a single platform, providing multi-scale imaging, guided workflows, and automated artificial intelligence (AI)-enabled reconstruction for non-destructive 3D imaging. Nicolas Gueninchault, Head of the X-ray Microscopy Field of Business at ZEISS Microscopy, stated that the system enables users to work more efficiently while balancing throughput, resolution, and ease of use. He noted that it helps protect valuable samples while providing 3D imaging capabilities.
ZEISS VersaXRM 5 Insight integrates large field-of-view with high-resolution imaging in one system, allowing users to inspect larger samples, zoom into regions of interest, and capture detailed 3D images without changing hardware configurations or interrupting workflows. The system combines the throughput, flexibility, and efficiency of microCT with the detailed imaging capabilities of laboratory-based X-ray microscopy, enabling a unified workflow for imaging large-scale structures and fine internal features while preserving sample integrity.
The system is equipped with Resolution at a Distance (RaaD), which enables high-resolution imaging of small features and internal defects within larger samples. This technology reduces the need to cut, trim, or refixture samples, helping users save time, reduce preparation errors, and protect delicate or difficult-to-reproduce specimens. Additionally, ZEISS VersaXRM 5 Insight features ZEN navx, an intuitive software environment with intelligent guidance and sample-aware navigation that simplifies setup and supports sample-specific imaging decisions.
The ZEISS VersaXRM 5 Insight supports applications across materials research, industrial inspection, and life sciences, including failure analysis, internal defect detection, part quality inspection, and 3D visualisation of biological structures across multiple scales. Moreover, the system supports in-situ and 4D studies in materials research, as well as root-cause analysis of semiconductor and electronic packages and yield improvement in manufacturing and quality assurance applications.